Mechanical analysis of press-pack IGBTs-Reference-Cited by-同舟云学术

Mechanical analysis of press-pack IGBTs

Published:2012-09 Issue:9-10 Volume:52 Page:2397-2402
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Poller T.,Basler T.,Hernes M.,D’Arco S.,Lutz J.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference7 articles.

1. Thermal–mechanical simulation of a multichip press packed IGBT;Pirondi;Solid State Electron,1998

2. Thermo-mechanical finite element analysis in press-packed IGBT design;Pirondi;Microelectron Reliab,2000

3. Wakeman F, Li G, Golland A. New family of 4.5kV press-pack IGBTs. In: Proceedings of the PCIM; 2005.

4. ANSYS user manual R14; 2012.

5. Lutz J, Basler T. Short-circuit ruggedness of high-voltage IGBTs. In: Proceedings of the MIEL’2012; 2012.

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