Power cycling testing and FE modelling focussed on Al wire bond fatigue in high power IGBT modules-Reference-Cited by-同舟云学术

Power cycling testing and FE modelling focussed on Al wire bond fatigue in high power IGBT modules

Published:2012-09 Issue:9-10 Volume:52 Page:2347-2352
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Schilling O.,Schäfer M.,Mainka K.,Thoben M.,Sauerland F.

Funder

BMBF of Germany

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference12 articles.

1. Further improvements in the reliability of IGBT modules;Schütze,1998

2. Investigations of high temperature IGBT module package structure;Horio;PCIM,2007

3. Power cycling test bench for IGBT power modules used in wind applications;Wagenitz;EPE,2011

4. Lifetime investigation of high power IGBT modules;Due;EPE,2011

5. Fast power cycling test for IGBT modules in traction application;Held,1997

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