The Influence of Asymmetric Printed-Circuit-Board Layout on the Reliability of Power Electronic Circuits
Author:
Affiliation:
1. BMW Group,Munich,Germany,80809
2. Technical University Munich,Munich,Germany,80333
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10264177/10264226/10264430.pdf?arnumber=10264430
Reference25 articles.
1. Overview of current thermal management of automotive power electronics for traction purposes and future directions;jones-jackson;IEEE Transactions on Transportation Electrification,2022
2. Power Electronics System Integration for Electric and Hybrid Vehicles;martin m�rz;2010 6th International Conference on Integrated Power Electronics Systems CIPS,2010
3. High frequency DC-DC converter using GaN device
4. Efficiency-Optimized High-Current Dual Active Bridge Converter for Automotive Applications
5. Failure and Reliability Analysis of a SiC Power Module Based on Stress Comparison to a Si Device
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