Investigation of gate voltage oscillations in an IGBT module after partial bond wires lift-off

Author:

Zhou Luowei,Zhou Shengqi,Xu Mingwei

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Cited by 32 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Online Prediction Method for the Remaining Useful Life of Power Devices Based on Composite Indicator;IEEE Transactions on Power Electronics;2024-08

2. A Comparative Study of Numerical Methods for IGBT Junction Temperature Estimation;2024 4th International Conference on Innovative Research in Applied Science, Engineering and Technology (IRASET);2024-05-16

3. IGBT Condition Monitoring Drive Circuit Based on Self-Excited Short-Circuit Current;IEEE Transactions on Power Electronics;2023-09

4. Review of the Failure Mechanism and Methodologies of IGBT Bonding Wire;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-07

5. In Situ Diagnosis for IGBT Chip Failure in Multichip IGBT Modules Based on a Newly Defined Characteristic Parameter Low-Sensitive to Operation Conditions;IEEE Transactions on Power Electronics;2023-06

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