Author:
Khong B.,Tounsi P.,Dupuy Ph.,Chauffleur X.,Legros M,Deram A.,Levade C.,Vanderschaeve G.,Dorkel J.-M.,Fradin J.-P.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference5 articles.
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5. REBECA-3D: the thermal conductive solver for microelectronics;Fradin;Microelectronics Journal,1998
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