REBECA-3D: the thermal conductive solver for microelectronics-Reference-Cited by-同舟云学术

REBECA-3D: the thermal conductive solver for microelectronics

Published:1998-09 Issue:9 Volume:29 Page:651-656
ISSN:0026-2692
Container-title:Microelectronics Journal
language:en
Short-container-title:Microelectronics Journal

Author:

Fradin J.P.,Desaunettes B.

Publisher

Elsevier BV

Subject

General Engineering

Reference7 articles.

1. Boundary Element: An Introductory Course;Brebbia,1991

2. REBECA-3D: The software for conductive fluxes and temperature fields prediction;Fradin,1996

3. Calculations of the temperature distribution throughout electronic equipments by the B.E.M. with the REBECA-3D software;Fradin;Eurotherm 45: Thermal Management of Electronic Systems,1995

4. Analysis of 3D conjugate heat transfers;Fradin,1997

5. REBECA-3D: a thermal tool for the design a electronic devices;Fradin,1997

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