Partition-based approach to parametric dynamic compact thermal modeling-Reference-Cited by-同舟云学术

Partition-based approach to parametric dynamic compact thermal modeling

Published:2017-12 Issue: Volume:79 Page:361-370
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Codecasa Lorenzo,d’Alessandro Vincenzo,Magnani Alessandro^ORCID,Rinaldi Niccolò,Metzger Andre G.,Bornoff Robin,Parry John

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference31 articles.

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5. An Arnoldi based thermal network reduction method for electro-thermal analysis;Codecasa;IEEE Trans. Compon. Packag. Technol.,2003

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