Affiliation:
1. a Philips Research Laboratories , Eindhoven , The Netherlands
Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Cited by
63 articles.
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1. Improved Compact Thermal Model for Over-Molded Packages;2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2023-10-25
2. The minimal set of IVL measurements to characterize power LED chips;2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2023-09-27
3. Boundary Condition Independent Compact Thermal Models Enhanced by Contour Elements;2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2023-09-27
4. Pareto based Multi-Objective Evolutionary Optimization of Multi-node Network for Thermal Modelling of Electronic Package;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30
5. Compact Thermal Modeling of Magnetic Components Using an Admittance Matrix Approach;Heat Transfer Engineering;2023-01-17