Author:
Codecasa L.,D'Amore D.,Maffezzoni P.
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Cited by
50 articles.
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1. Boundary Condition Independent Compact Thermal Models Enhanced by Contour Elements;2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2023-09-27
2. Structure Curve Representation of Dynamic Thermal Multi-Ports;2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2023-09-27
3. 3D Compact Thermal Model and its Application on Fast Chip Level Thermal Simulation;2023 International Symposium of Electronics Design Automation (ISEDA);2023-05-08
4. Structure-Preserving Model Order Reduction for Thermal Analysis;2023 International Symposium of Electronics Design Automation (ISEDA);2023-05-08
5. Determining the Contribution of Spatial Sub-Regions to Structure Functions;2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2022-09-28