Author:
Feil D.,Herberholz T.,Guyenot M.,Nowottnick M.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference8 articles.
1. Datasheet for IGBT 3 Chip;Infineon Technologies,25062011
2. Selected failure mechanisms of modern power modules;Ciappa;Microelectron. Reliab.,2002
3. Investigation of pre-bending substrate design in packaging assembly of an IGBT power module;Chang-Chun;Microelectron. Eng.,2014
4. Neue Reflowlöttechnologie für elektronische Anwendungen bis 300°C;Nowottnick,2015
5. Fix A. Herberholz T. Method for creating a soldered connection and circuit component. European Patent EP2713685. 2014.
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