Funder
National Natural Science Foundation of China
Program for New Century Excellent Talents in University
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference57 articles.
1. Uniaxial ratcheting and fatigue behaviors of low-temperature sintered nano-scale silver paste at room and high temperatures;Wang;Mater. Sci. Eng. A,2010
2. A lead-free, low-temperature sintering die-attach technique for high-performance and high-temperature packaging, high density microsystem design and packaging and component failure analysis;Lu;Proceeding of the Sixth IEEE CPMT Conference on IEEE,2004
3. Low-temperature Sintering of Nanoscale Silver Paste for Semiconductor Device Interconnection;Bai,2005
4. Thermomechanical reliability of low-temperature sintered silver die attached SiC power device assembly, IEEE;Bai;Trans. Device Mater. Reliab.,2006
5. Low-temperature sintering with nano-silver paste in die-attached interconnection;Wang;J. Electron. Mater.,2007
Cited by
11 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献