1. Power modules with increased power density and reliability using Cu wire bonds on sintered metal buffer layers;Rudzki,2014
2. Impact of absolute junction temperature on power cycling lifetime;Schmidt,2013
3. Enhanced power cycling performance of IGBT modules with a reinforced emitter contact;Ozkol;Microelectron. Reliab.,2015
4. Higher junction temperature in power modules - a demand from hybrid cars, a potential for the next step increase in power density for various variable speed drives;Bayerer,2008
5. Active cycling reliability of power devices: expectations and limitations;Kanert;Microelectron. Reliab.,2012