Advantages of the extended finite element method for the analysis of crack propagation in power modules
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Elsevier BV
Reference55 articles.
1. A review on IGBT module failure modes and lifetime testing;Abuelnaga;IEEE Access,2021
2. Unusual observations in the wear-out of high purity aluminium wire bonds under extended range passive thermal cycling;Agyakwa;IEEE Transactions Device and Materials Reliability,2010
3. Improved implementation and robustness study of the X-FEM for stress analysis around cracks;Béchet;International Journal for Numerical Methods in Engineering,2000
4. Partition of unity method;Babuska;International Journal for Numerical Methods in Engineering,1997
5. The conservative M-integral for thermo- elastic problems;Banks-Sills;International Journal of Fracture,2004
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