Coupled thermal-mechanical analysis of power electronic modules with finite element method and parametric model order reduction-Reference-Cited by-同舟云学术

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Coupled thermal-mechanical analysis of power electronic modules with finite element method and parametric model order reduction

Published:2024-08 Issue: Volume:8 Page:100063
ISSN:2772-3704
Container-title:Power Electronic Devices and Components
language:en
Short-container-title:Power Electronic Devices and Components

Author:

Hassan Sheikh^ORCID,Rajaguru Pushparajah,Stoyanov Stoyan,Bailey Christopher,Tilford Timothy

Funder

Engineering and Physical Sciences Research Council

Publisher

Elsevier BV

Reference40 articles.

1. ANSYS (2023). Mechanical APDL 2023 R1 - Theory Reference.

2. Material property data for engineering materials;Ashby,2016

3. Robust error assessment for reduced order vibro-acoustic problems;Aumann;Journal of Sound and Vibration,2023

4. Multi-port dynamic compact thermal models of BGA package using model order reduction and metaheuristic optimization;Bissuel,2019

5. System-level model and simulation of a frequency-tunable vibration energy harvester;Bouhedma;Micromachines,2020

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