New model of crack propagation of aluminium wire bonds in IGBT power modules under low temperature variations

Author:

Halouani A.,Khatir Z.,Lallemand R.,Ibrahim A.,Ouhab M.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference22 articles.

1. Analysis of the aging mechanism occurring at the bond-wire contact of IGBT power devices during power cycling;Dornic;Microelectron. Reliab.,2020

2. Thermal and structural simulation techniques for estimating fatigue life of an IGBT module;Sasaki,2008

3. Strategy for designing accelerated aging tests to evaluate IGBT power modules lifetime in real operation mode;Thebaud;IEEE Trans. Components Packaging Technol.,2003

4. Reliability of power cycling for IGBT power semiconductor modules;Morozumi;IEEE Trans. Industry Appl.,2003

5. Reliability of power cycling for IGBT power semiconductor modules;Morozumi,2001

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1. A stochastic model-based prognostic for IGBT power module remaining useful life estimation using a physical model-based shape function;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07

2. Hybrid modeling for remaining useful life prediction in power module prognosis;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07

3. Study of bonding parameters with Al and Au wires on Pd and Ag coatings;Journal of Physics: Conference Series;2024-02-01

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