Study on the shear strength degradation of ACA joints induced by different hygrothermal aging conditions-Reference-Cited by-同舟云学术

Study on the shear strength degradation of ACA joints induced by different hygrothermal aging conditions

Published:2013-12 Issue:12 Volume:53 Page:2030-2035
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Wu Guanghua,Tao Bo,Yin Zhouping

Funder

National Science Foundation of China

National Fundamental Research Program of China

New Century Excellent Talents Plan of Education Ministry

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference22 articles.

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3. Review of recent advances in electrically conductive adhesive materials and technologies in electronic packaging;Yim;J Adhes Sci Technol,2008

4. Liu J, Lai ZH, Kristianse H, et al. Overview of conductive adhesive joining technology in electronics packaging applications. In: Proceedings of the 3rd international conference on adhesive joining and coating technology in electronics manufacturing; 1998. p. 1–18.

5. ACA bonding technology for low cost electronics packaging applications – current status and remaining challenges;Liu;Solder Surf Mt Tech,2001

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