Mechanical properties of cured isotropic conductive adhesive (ICA) under hygrothermal aging investigated by micro-indentation-Reference-Cited by-同舟云学术

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Mechanical properties of cured isotropic conductive adhesive (ICA) under hygrothermal aging investigated by micro-indentation

Published:2017-09 Issue: Volume:122-123 Page:81-90
ISSN:0020-7683
Container-title:International Journal of Solids and Structures
language:en
Short-container-title:International Journal of Solids and Structures

Author:

Xiao Gesheng,Liu Erqiang,Jin Tao,Shu Xuefeng,Wang Zhihua,Yuan Guozheng,Yang Xuexia

Publisher

Elsevier BV

Subject

Applied Mathematics,Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science,Modelling and Simulation

Reference42 articles.

1. Moisture induced failures in flip chip on flex interconnections using anisotropic conductive adhesives;Caers,2003

2. Scaling, dimensional analysis, and indentation measurements;Cheng;Mater. Sci. Eng. R,2004

3. High performance electrically conductive adhesives from functional epoxy, micron silver flakes, micron silver spheres and acidified single wall carbon nanotube for electronic package;Cui;Int. J. Adhes. Adhes.,2013

4. Nanoindentation assisted analysis of biochar added biocomposites;Das;Composites Part B,2016

5. Effects of creep and thermal drift on modulus measurement using depth-sensing indentation;Feng;J. Mater. Res.,2002

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3. Characterization of power-law constitutive relationship of nickel-based single crystal superalloys under different loading rates by nanoindentation with different types of indenters;International Journal of Solids and Structures;2022-12

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