1. Schmidt R, Scheuermann U. Using the chip as a temperature sensor – the influence of steep lateral temperature gradients on the VCE(T)-measurement. In: Proc EPE 2009, CD-ROM; 2009.
2. On the effect of power cycling stress on IGBT modules;Cova;Microelectron Reliab,1998
3. Schuler S, Scheuermann U. Impact of test control strategy on power cycling lifetime. In: Proc PCIM, Europe; 2010. p. 355–60.
4. Held M, Jacob P, Nicoletti G, Scacco P, Poech MH. Fast power cycling test for igbt modules in traction application. In: Proc power conversion and drive systems; 1997. p. 425–30.
5. Bayerer R, Herrmann T, Licht T, Lutz J, Feller M. Model for power cycling lifetime of IGBT modules – various factors influencing lifetime. In: Proc CIPS 2008, Nuremberg, ETG-Fachbericht 111; 2008. p. 37–42.