Drop simulation/experimental verification and shock resistance improvement of TFT–LCD monitors

Author:

Pan Min-Chun,Chen Po-Chun

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference13 articles.

1. Suhir E. Dynamic response of a one-degree-of-freedom linear system to a shock load during drop tests: effect of viscous damping. IEEE Trans Compon Pack Manuf Technol – Part A 19(3):435–40.

2. Suhir E. Could shock tests adequately mimic drop test conditions? In: Proceedings of IEEE the 52nd electronic components and technology conference; 2002. p. 563–73.

3. Suhir E. Could shock tests adequately replace drop tests? In: Proceedings of IEEE the 8th international symposium on advanced packaging materials; 2002. p. 563–73.

4. Effect of the drop impact on BGA/CSP package reliability;Mishiro;Microelectron Reliab,2002

5. Zhu L, Marcinkiewicz W. Drop impact reliability analysis of CSP packages at board and product system levels through modeling approaches. In: Proceedings of IEEE 2004 inter society conference on thermal phenomena; 2004. p. 296–303.

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