1. Syed A. Predicting solder joint reliability for thermal, power, and bend cycle within 25% accuracy. In: Proc 51st electronic components and technology conference, Orlando, FL; 2001. p. 255–63.
2. Effect of simulation methodology on solder joint crack growth correlation and fatigue life prediction;Darveaux;J Electron Pack, ASME,2002
3. Zahn BA. Impact of ball via configurations on solder joint reliability in tape based chip-scale packages. In: Proc 52nd electronic components and technology conference, San Diego, CA; 2002. p. 1475–83.
4. Lu H, Bailey C. Predicting optimal process conditions for flip-chip assembly using copper column bumped dies. In: Proc 4th electronics packaging technology conference, Singapore; 2002. p. 338–43.
5. Effect of underfill thermomechanical properties on thermal cycling fatigue reliability of flip-chip ball grid array;Wang;J Electron Pack, ASME,2004