Effects of pre-bump probing and bumping processes on eutectic solder bump electromigration

Author:

Chen Kuo-Ming,Wu J.D.,Chiang Kuo-Ning

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference11 articles.

1. Assembly and packaging. International technology roadmap for semiconductors, 1999. p. 223.

2. Impact of probing procedure on flip chip reliability;Chen;Microelectron Reliab,2003

3. Black JR. Mass transport of an aluminum by momentum exchange with conducting electrons. In: IEEE/IRPS international reliability physics symposium, April 1967. p. 148–59.

4. Nakagawa K et al. Thermo-electromigration phenomenon of solder bump, leading to flip-chip devices with 5000 bumps. In: IEEE electronic components and technology conference, June 2001. p. 971–7.

5. Choi WJ et al. Electromigration of flip chip solder bump on Cu/Ni(V)/Al thin film under bump metallization. In: IEEE electronic components and technology conference, US, May 2002. p. 1201–5.

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