Impact of probing procedure on flip chip reliability-Reference-Cited by-同舟云学术

Impact of probing procedure on flip chip reliability

Published:2003-01 Issue:1 Volume:43 Page:123-130
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Chen Kuo-Ming,Chiang Kuo-Ning

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference10 articles.

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2. Tan Q et al. Reliability evaluation of probe-before-bump technology. In: IEEE/CPMT International Electronics Manufacturing Technology Symposium, Austin, TX, 1999. p. 320–4

3. Low cost flip chip technologies for DCA, WLCSP, and PBGA assemblies;Lau,2000

4. Thermally actuated microprobes for a new wafer probe card;Zhang;IEEE J. Microelectromech. Syst.,1999

5. A BiCMOS active substrate probe-card technology for digital testing;Zargari;IEEE J. Solid-state Circ.,1999

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