On the difference between thermal cycling and thermal shock testing for board level reliability of soldered interconnections-Reference-Cited by-同舟云学术

On the difference between thermal cycling and thermal shock testing for board level reliability of soldered interconnections

Published:2007-02 Issue:2-3 Volume:47 Page:444-449
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

de Vries J.W.C.,Jansen M.Y.,van Driel W.D.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference17 articles.

1. Syed A. Thermal fatigue reliability enhancement of plastic ball grid array (PBGA) packages. In: Proc ECTC, 1996. p. 1211–6.

2. van Driel WD, Zhang GQ, de Vries JWC, Jansen MY, Ernst LJ. Virtual prototyping and qualification of board level assembly. In: Proc EPTC, 2004. p. 772–5.

3. Syed A. Accumulated creep strain and energy density based thermal fatigue life prediction models for SnAgCu solder joints. In: Proc ECTC, 2004. p. 737–46.

4. Jansen KMB, Wang L, Yang DG, van’t Hof C, Ernst LJ, Bressers HJL, et al. Constitutive modeling of molding compounds. In: Proc ECTC, 2004. p. 890–4.

5. Syed A, Darveaux R. LGA vs. BGA: what is more reliable? A 2nd level reliability comparison. In: Proc SMTA, 2000. p. 347–52.

Cited by 16 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Thermomechanical Reliabilities of Pb-Free Solder Joints According to Ag Content in Harsh Environment;IEEE Transactions on Reliability;2023-12

2. Reliability Examinations of SAC Lead Free Solder Material;Archives of Metallurgy and Materials;2023-07-26

3. Reliability Assessment of Solder Joints in Electronic Devices Under Extreme Thermal Fluctuations;IEEE Transactions on Components, Packaging and Manufacturing Technology;2020-08

4. Comparative study on the reliability of SnPbSb solder joint under common thermal cycling and extreme thermal shocking;Journal of Materials Science: Materials in Electronics;2020-02-24

5. Examination the effect of thermal shock test on SAC solder joints fabricated by THRS and multiwave soldering techniques;Resolution and Discovery;2019-12