Author:
Sundaramoorthy V.K.,Bianda E.,Bloch R.,Angelosante D.,Nistor I.,Riedel G.J.,Zurfluh F.,Knapp G.,Heinemann A.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference19 articles.
1. Real-time compact thermal models for health management of power electronics;Musallam;IEEE Trans Power Electron,2010
2. A novel thermo mechanics-based lifetime prediction model for cycle fatigue failure mechanisms in power semiconductors;Ciappa;Microelectron Reliab,2002
3. Transmission fabry – perot interference thermometry for thermal characterization of microelectronic devices;Perpina;Semiconductor Sci Technol,2006
4. Brekel W, Dütemeyer T, Puk G, Schilling O. Time resolved in situ chip temperature measurements during inverter operation. In: Power Conversion Intelligent Motion Conference (PCIM Europe), Nuremberg (Germany); May 2009. p. 808–13.
5. Choosing a thermal model for electrothermal simulation of power semiconductor devices;Ammous;IEEE Trans Power Electron,1999
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