Reliability matrix solution to multiple mechanism prediction-Reference-Cited by-同舟云学术

Reliability matrix solution to multiple mechanism prediction

Published:2014-12 Issue:12 Volume:54 Page:2951-2955
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Bernstein Joseph B.,Gabbay Moti,Delly Ofir

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference8 articles.

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3. BTI, HCI and TDDB aging impact in flip–flops;Nunes;Microelectron Reliab,2013

4. From defects creation to circuit reliability – a bottom-up approach;Huard;Microelectro Eng,2011

5. JEDEC Publication. Failure mechanisms and models for semiconductor devices, JEP-122G, October 2011.

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