BTI, HCI and TDDB aging impact in flip–flops-Reference-Cited by-同舟云学术

BTI, HCI and TDDB aging impact in flip–flops

Published:2013-09 Issue:9-11 Volume:53 Page:1355-1359
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Nunes Cícero,Butzen Paulo F.,Reis André I.,Ribas Renato P.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference22 articles.

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1. References;Reliability Prediction for Microelectronics;2024-02-16

2. The Effects of Process Variations and BTI in Packaged FinFET Devices;2023 IEEE International Reliability Physics Symposium (IRPS);2023-03

3. BAS: A BTI-based aging aware synthesis in FPGAs;Microelectronics Reliability;2022-12

4. BTI-Aware Timing Reliability Improvement of Pulsed Flip-Flops in Nano-Scale CMOS Technology;IEEE Transactions on Device and Materials Reliability;2021-09

5. Selective Flip-Flop Optimization for Circuit Reliability;Dependable Embedded Systems;2020-12-10