Effect of aluminum concentration on the microstructure and mechanical properties of Sn–Cu

Effect of aluminum concentration on the microstructure and mechanical properties of Sn–Cu–Al solder alloy

Published:2015-02 Issue:3-4 Volume:55 Page:596-601
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Yang Li,Zhang Yaocheng,Du Chengchao,Dai Jun,Zhang Ning

Funder

National Natural Science Foundation of China

Science and Technology Program of Jiangsu Province of China

Science and Technology Program of Suzhou

Natural Science Foundation of the Jiangsu Higher Education Institutions of China

Scientific Research Project of Changshu Institute of Technology

Jiangsu Key Laboratory of Large Engineering Equipment Detection and Control

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference22 articles.

1. Six cases of reliability study of Pb-free solder joints in electronic packaging technology;Zeng;Mater Sci Eng R-Rep,2002

2. Reliability of Pb-free solders for harsh environment electronic assemblies;Desmarest;Mater Sci Technol,2012

3. A review: on the development of low melting temperature Pb-free solders;Kotadia;Microelectron Reliab,2014

4. Impact of Ni concentration on the intermetallic compound formation and brittle fracture strength of Sn–Cu–Ni (SCN) lead-free solder joints;Yang;Microelectron Reliab,2014

5. Microstructure and mechanical properties of Sn–Zn–Bi–Cr lead-free solder;Luo;Microelectron Reliab,2012

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3. Microstructural, thermal and mechanical properties of Co added Sn–0.7Cu lead-free solder alloy;Journal of Materials Science: Materials in Electronics;2023-02-21

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