Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference24 articles.
1. Moisture absorption and desorption predictions for plastic ball grid array packages;Galloway;IEEE Trans Compon Packag Manuf Technol Part A,1997
2. Wong EH, Teo YC, Lim TB. Moisture diffusion and vapour pressure modeling for electronic packaging. In: Proc. 48th electron. compon. technol. conf., Seattle; 1998. p. 1372–78.
3. Experiments on the quantity of gases absorbed by water, at different temperatures, and under different pressures;Henry;Philos Trans Royal Soc (London),1803
4. Avoid common pitfalls when using Henry’s law;Smith;Chem Eng Progress,2007
5. Abaqus 6.11, theory manual .
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