Investigating moisture diffusion in Mold Compounds (MCs) for Fan-Out-Wafer-Level-Packaging (FOWLP)
Author:
Affiliation:
1. Imec,Leuven,Belgium,B-3001
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816650.pdf?arnumber=9816650
Reference37 articles.
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4. Characterization of Hygroscopic Swelling and Thermo-Hygro-Mechanical Design on Electronic Package
5. Analysis and comparison of thermal stress and hygrothermal stress of SiP device by QFN packaging;haihua;International Conference on Electronic Packaging Technology & High Density Packaging,2008
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