Reliability Investigations of Polymer Based Redistribution Layers (RDL) Protected by a Mold Layer

Author:

Kwak Ji-Youn1,Chery Emmanuel2,Bertheau Julien2,Slabbekoorn John2,De Messemaeker Joke2,Beyne Eric2

Affiliation:

1. University of Ulsan,Ulsan,Republic of Korea

2. Imec,Leuven,Belgium

Funder

MOTIE (Ministry of Trade, Industry, and Energy) in Korea

Korea Institute for Advancement of Technology (KIAT)

Publisher

IEEE

Reference23 articles.

1. Inorganic capping layers in advanced photosensitive polymer based RDL processes: processing and reliability;pinho;2023 IEEE Electron Compon Technol Conf (ECTC),0

2. Vapor deposited thin organic–inorganic capping layers preventing copper line oxidation in polymer-based RDL technologies

3. Percolation and Jamming in Random Heterogeneous Materials with Competing Length Scales

4. Standard Test Method for Moisture Absorption Properties and Equilibrium Conditioning of Polymer Matrix Composite Materials;Annual Book of ASTM Standards,2010

5. A Mechanics Model for the Moisture Induced Delamination in Fan-Out Wafer-Level Package

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