Improving reliability of beveled power semiconductor devices passivated by SIPOS

Author:

Wang Ying,Zhu Changchun,Wu Chunyu,Liu Junhua

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference15 articles.

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2. On the high temperature operation of high voltage power devices;Obreja;CAS Int. Proc.,2002

3. Investigation on operation of silicon power devices in the breakdown region of electrical characteristic;Obreja;CAS Int. Proc.,2001

4. On the nature of leakage current of fast recovery silicon pn junctions;Obreja;CAS Int. Proc.,1996

5. Effect of bulk carrier generation-recombination centers upon the I–V characteristic of silicon PN junctions;Obreja;CAS Int. Proc.,1998

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3. Analysis of Passivation Layer Interface Charge Induced Blocking Capability Degradation in Thyristor;2023 IEEE 4th International Conference on Electrical Materials and Power Equipment (ICEMPE);2023-05-07

4. TCAD Investigation of Differently Doped DLC Passivation for Large-Area High-Power Diodes;IEEE Journal of Emerging and Selected Topics in Power Electronics;2021-04

5. Ageing of glass passivated TRIAC devices under thermal and electrical stress;Microelectronics Reliability;2020-11

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