Ageing of glass passivated TRIAC devices under thermal and electrical stress-Reference-Cited by-同舟云学术

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Ageing of glass passivated TRIAC devices under thermal and electrical stress

Published:2020-11 Issue: Volume:114 Page:113767
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Buvat Y.,Bouyssou E.,Morillon B.,Gautier G.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference18 articles.

1. Proceedings of ICETECT, India;Pal,2011

2. ICEE Asia, Korea;Shin,2019

3. Non-oxidized porous silicon-based power AC switch peripheries

4. Investigation of Porous Silicon-Based Edge Termination for Planar-Type TRIAC

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