Reliability study of new SnZnAl lead-free solders used in CSP packages-Reference-Cited by-同舟云学术

Reliability study of new SnZnAl lead-free solders used in CSP packages

Published:2005-07 Issue:7-8 Volume:45 Page:1208-1214
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Kitajima Masayuki,Shono Tadaaki

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference5 articles.

1. Heat resistance of Sn9Zn solder/Cu interface with or without coating;Suganuma;J. Mater. Res.,2000

2. Kitajima M, Shono T, Takesue M, Yamazaki K. Development of the SnZnAl solder Alloy. MES2001 Theses for the 11th Micro Electronics Symposium; 2001.

3. Kitajima M, Shono T, Yamazaki K, Noguchi M. Study on metallograph of lead-free SnZnAl solders. MES2003 Theses for the 13th Micro Electronics Symposium; 2003.

4. Kitajima M, Shono T, Yamazaki K, Noguchi M. Reliability of the SnZnAl solder alloy. MES2002 Theses for the 12th Micro Electronics Symposium; 2002.

5. A 100-GHz distributed amplifier in chip-size package;Masuda;IEEE MTT-S Int. Microwave Symp. Dig.,2003

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