1. Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS);European Parliament;Off. J. Eur. Union,2011
2. Lead free solder joints characterisation using single lap shear tests;Pin,2017
3. The stress state of BGA solder joints influenced by the grain orientations of neighboring joints;Lovberg;Proceedings - Electronic Components and Technology Conference,2018
4. Voids in solder joints;Aspandiar;Journal of SMT Article,2006
5. Effect of voids on the reliability of BGA/CSP solder joints;Yunus;Microelectron. Reliab.,2003