Effect of voids on the reliability of BGA/CSP solder joints-Reference-Cited by-同舟云学术

Effect of voids on the reliability of BGA/CSP solder joints

Published:2003-12 Issue:12 Volume:43 Page:2077-2086
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Yunus Mohammad,Srihari K.,Pitarresi J.M.,Primavera Anthony

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference8 articles.

1. Lee NCh, O’Hara. Voiding in BGA. In: Proceeding of Surface Mount International, San Jose, California, 1995

2. Soldering in electronics;Wassink,1989

3. Primavera AA, Strum R, Prasad S, Srihari K. Factors that affect void formation. In: Proceedings of Surface Mount Technology Association, 1998

4. Solder paste in electronics packaging;Hwang,1989

5. Primavera AA. MDS testing of BGA solder joints. Technical Report, BGA/DCA Consortium, Universal Instruments Corporation, Binghamton, New York, 1996

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