Subject
Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science
Reference6 articles.
1. The Effects of Entrapped Bubbles in Solder Used for the Attachment of Leadless Ceramic Chip Carriers
2. Tvergaard, V. 'Material Failure by Void Growth to Coalescence', in 'Advances in Applied Mechanics', Vol.27, Pergamon Press, pp.83-149(1989).
3. Hance, W. B. and Lee,N.C.'Formation and Control of Voiding in SMT', Proceedings ISHM Conference, San Francisco, CA, p.535 (1992).
Cited by
6 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献