Author:
Schreier-Alt Thomas,Rehme Frank,Ansorge Frank,Reichl Herbert
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference22 articles.
1. Encapsulation technologies for electronic applications;Ardebili,2009
2. Marenco N et al. Investigation of key technologies for system-in-package integration of inertial mems. In: Symposium on design, test, integration and packaging of MEMS/MOEMS; Rome, Italy: 1–3 April, 2009.
3. Falat T et al. The influence of process parameters and materials properties on stress distribution in MEMS – ASIC integrated systems after molding – numerical and experimental approach. In: International conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems, EuroSimE 2009, Delft, The Netherlands; 2009.
4. Modern IC packaging trends and their reliability implications;Plieninger;Microelectron Reliab,2006
5. Meyer T, Ofner G, Bradl S, Brunnbauer M, Hagen R. Embedded wafer level ball grid array (eWLB). In: Proceedings of the 2008 electronic packaging technology conference (EPTC), Singapore, December 9–12; 2008. p. 994–8, .
Cited by
16 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献