Modern IC packaging trends and their reliability implications-Reference-Cited by-同舟云学术

Modern IC packaging trends and their reliability implications

Published:2006-09 Issue:9-11 Volume:46 Page:1868-1873
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Plieninger R.,Dittes M.,Pressel K.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference9 articles.

1. see http://public.itrs.net (status 14.07.2006).

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3. Ebersberger B, Bauer R, Alexa L. Qualification of SnAg Solder Bumps for Lead-Free Flip Chip Application. 54th Electronics Component Technology Conference ECTC 2004, Las Vegas, NV, p. 683–91.

4. Birzer C, Rakow B, Steiner R, Walter J. Drop Test Reliability Improvement of Lead-Free Fine Pitch BGA Using Different Solder Ball Composition”, Electronics Packaging Technology Conference 7th EPTC 2005, Singapore, p. 255–61.

5. Birzer C, Stoeckl S, Schuetz G, Fink M. Reliability Investigations of Leadless QFN Packages until End-of-Life with Application Specific Board Level Stress Tests. 56th Electronic Components Technology Conference ECTC 2006, San Diego, CA, p. 594–600.

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