New aspects in characterization of adhesion of moulding compounds on different surfaces by using a simple button-shear-test method for lifetime prediction of power devices-Reference-Cited by-同舟云学术

New aspects in characterization of adhesion of moulding compounds on different surfaces by using a simple button-shear-test method for lifetime prediction of power devices

Published:2010-09 Issue:9-11 Volume:50 Page:1684-1687
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Goroll Michael,Pufall Reinhard

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference19 articles.

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2. Automotive Electronic Council. AEC-Q101-Rev-C; 2005.

3. McEnteggart. Characterization of interfacial cracking in microelectronic packaging. .

4. SEMI Standard G69-0996. Test method for measurement of adhesive strength between lead frames and molding compounds.

5. Szeto et al. Interface failure criterion of button shear test as a means of interface adhesion measurement in plastic packages. In: Proceedings IEEE electronic materials and packaging symposium (EMAP); 2000. p. 263–8.

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