Author:
Che F. X.,Zhang X. R.,Ji L.
Cited by
12 articles.
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1. Fatigue-Fracture Propensity Measurement and Competing Risk Model for FCBGA Interfaces under Sustained Humidity and Temperature Exposure;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. Assessment of Competing Risk-of-Failure in FCBGA Interfaces Operating in Harsh Automotive Underhood Environments for Periods up to 1-Year;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07
3. THz-TDS for IC packaging material changes detection under real-world conditions;Terahertz, RF, Millimeter, and Submillimeter-Wave Technology and Applications XVII;2024-03-11
4. Thermomechanical Challenges of 2.5-D Packaging: A Review of Warpage and Interconnect Reliability;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-10
5. Influence of Thermally Aged Underfill on Flip-Chip Packages;2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC);2023-09-11