Author:
Pflügler Nadine,Reuther Georg M.,Goroll Michael,Udiljak Dominik,Pufall Reinhard,Wunderle Bernhard
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference27 articles.
1. Increasing the robustness for reliable packages by prediction of delamination by cohesive zone element simulation;Pufall,2012
2. Determination of adhesion and delamination prediction for semiconductor packages by using Grey Scale Correlation and Cohesive Zone Modelling;Goroll;Microelectron. Reliab.,2012
3. Developing the mesoscale stress-strain curve to failure;Iwamoto,2011
4. Molecularly derived mesoscale modelling of an epoxy/Cu interface (part III): interface roughness;Iwamoto,2012
5. Aspects of scaling to mesoscale models derived from the molecular scale for understanding epoxy interfaces;Iwamoto,2012
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