Author:
Dornic N.,Ibrahim A.,Khatir Z.,Tran S.H.,Ousten J.-P.,Ewanchuk J.,Mollov S.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Cited by
10 articles.
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1. Dynamics of thermal destruction of Al-(Ti,SiO2)-Si structures under pulsed action;Third International Conference on Optics, Computer Applications, and Materials Science (CMSD-III 2023);2024-02-20
2. Wirebond State-of-Health Measurements Using Specific, Nondestructive Electrical and Thermal Methods;IEEE Journal of Emerging and Selected Topics in Power Electronics;2023-12
3. Metallization system as a part of thermal memory;Heliyon;2023-05
4. Probabilistic and Physics-Informed Machine Learning for Predictive Maintenance with Time Series Data;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17
5. An EBSD Study of Fatigue Crack Propagation in Bonded Aluminum Wires Cycled from 55°C to 85°C;Journal of Electronic Materials;2022-10-03