Author:
Wang Z.X.,Wang H.,Zhang Y.,Blaabjerg F.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference13 articles.
1. Experimental validation of a thermal modelling method dedicated to multichip power modules in operating conditions;Carubelli;Microelectron. J.,2003
2. Advanced accelerated power cycling test for reliability investigation of power device modules;Choi;IEEE Trans. Power Electron.,2016
3. JESD51-14: Transient Dual Interface Test Method for the Measurement of the Thermal Resistance Junction-to-case of Semiconductor Devices With Heat Flow Through a Single Path;JEDEC,2010
4. Real-time prediction of power electronic device temperatures using PRBS-generated frequency-domain thermal cross coupling characteristics;Davidson;IEEE Trans. Power Electron.,2015
5. Non-linear thermal simulation at system level: compact modelling and experimental validation;Bernardoni;Microelectron. Reliab.,2018
Cited by
6 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献