A Method to Derive the Coupling Thermal Resistances at Junction-to-Case Level in Multichip Power Modules
Author:
Affiliation:
1. Research and Development Center, Zhuzhou CRRC Times Semiconductor Ltd., Zhuzhou, China
2. Research and Development Center, Dynex Semiconductor Ltd., Lincoln, U.K.
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Link
http://xplorestaging.ieee.org/ielx7/63/9952160/09903626.pdf?arnumber=9903626
Reference30 articles.
1. On the reproducibility of thermal measurements and of related thermal metrics in static and transient tests of power devices;farkas;Energies,2020
2. Influence of Thermal Coupling on Lifetime Under Power Cycling Test
3. Transient dual interface measurement — A new JEDEC standard for the measurement of the junction-to-case thermal resistance
4. Thermal transient characterization of semiconductor devices with multiple heat sources—Fundamentals for a new thermal standard
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. A Fourier Series-Based Steady-State Thermal Resistance Model for Power Module;IEEE Journal of Emerging and Selected Topics in Power Electronics;2024-08
2. Investigation into Temperature Dependency on Thermal Characterization of IGBT Modules Based on Structure Function;2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia);2024-05-17
3. A Thermal Network Model for Multichip Power Modules Enabling to Characterize the Thermal Coupling Effects;IEEE Transactions on Power Electronics;2024-05
4. Enhancing the Resilience of Medical Equipment with Innovative IGBT Protection Strategies in Modern Smart Grid Ecosystems;2024 9th Asia Conference on Power and Electrical Engineering (ACPEE);2024-04-11
5. Distributed Thermal Modeling for Power Devices and Modules With Equivalent Heat Flow Path Extraction;IEEE Journal of Emerging and Selected Topics in Power Electronics;2023-12
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3