Author:
Balmont M.,Bord Majek I.,Poupard B.,Bechou L.,Ousten Y.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference20 articles.
1. “3D Microelectronic Packaging”, ed. by Y. Li and D. Goyal, Springer, Cham, 2017.
2. Effect of thermal mechanical behaviors of cu on stress distribution in cu-filled through-silicon Vias under heat treatment;Zhao;J. Electron. Mater.,2018
3. Thermo-mechanical simulation of PCB with embedded components;Kpobie;Microelectron. Reliab.,2016
4. Achieving Maxwell-accurate electro-magnetic integrity in Chip-Package-System Design;Mentor site,2011
5. Scanning Acoustic Microscopy and Shear Wave Imaging Mode Performances for Failure Detection in High-density Microassembling Technologies;Remili,2015
Cited by
4 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献