Toward Preeminent Throwing Power from a Novel Alkaline Copper Electronic Electroplating Bath with Composite Coordination Agents-Reference-Cited by-同舟云学术

Toward Preeminent Throwing Power from a Novel Alkaline Copper Electronic Electroplating Bath with Composite Coordination Agents

Published:2022-06-07 Issue:11 Volume:9 Page:
ISSN:2196-0216
Container-title:ChemElectroChem
language:en
Short-container-title:ChemElectroChem

Author:

Li Wei‐Qing¹,Jin Lei¹,Yang Jia‐Qiang¹,Wang Zhao‐Yun¹,Zhan Dongping¹,Yang Fang‐Zu¹^ORCID,Tian Zhong‐Qun¹

Affiliation:

1. Department of Chemistry State Key Laboratory of Physical Chemistry of Solid Surfaces (PCOSS) Engineering Research Center of Electrochemical Technologies of Ministry of Education College of Chemistry and Chemical Engineering Xiamen University Xiamen 361005 China

Funder

National Natural Science Foundation of China

Publisher

Wiley

Subject

Electrochemistry,Catalysis

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/celc.202200423

Reference48 articles.

1. An overview of through-silicon-via technology and manufacturing challenges

2. Sintered Nanocopper Paste for High-Performance 3D Heterogeneous Package Integration

3. Advanced Manufacturing Technology of Microwave Multilayer Printed Circuit Board

4. Application of non-woven aramid-polyimide composite materials for high reliability printed circuit boards for use in spacecraft electronics

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