Methodology of determining the applicability range of the DPL model to heat transfer in modern integrated circuits comprised of FinFETs-Reference-Cited by-同舟云学术

Methodology of determining the applicability range of the DPL model to heat transfer in modern integrated circuits comprised of FinFETs

Published:2018-12 Issue: Volume:91 Page:139-153
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Zubert Mariusz^ORCID,Raszkowski Tomasz,Samson Agnieszka,Zając Piotr

Funder

Internal Doctoral Scholarship

Polish National Science Centre

Polish Academy of Sciences

National Academy of Sciences of Ukraine

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

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