Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials
Cited by
23 articles.
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1. Development of a reduced-order AROMM model for the nonlinear thermal simulation of electronic components;International Journal of Heat and Mass Transfer;2024-11
2. Boundary Condition Independent Compact Thermal Models Enhanced by Contour Elements;2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2023-09-27
3. Structure Curve Representation of Dynamic Thermal Multi-Ports;2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2023-09-27
4. Determining the Contribution of Spatial Sub-Regions to Structure Functions;2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2022-09-28
5. Analytical Modeling and Numerical Simulation of Nonlinear Thermal Effects in Bipolar Transistors;2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2022-09-28