Thermal modeling of wire-bonded power modules considering non-uniform temperature and electric current interactions

Author:

Akbari M.,Bahman A.S.,Reigosa P.D.,Iannuzzo F.,Bina M.T.ORCID

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference21 articles.

1. Condition monitoring for device reliability in power electronic converters: a review;Yang;IEEE Trans. Power Electron.,2010

2. Thermal cycling overview of multi-megawatt two-level wind power converter at full grid code operation;Zhou;IEEJ J. Ind. Appl.,2013

3. Real-time temperature estimation for power MOSFETs considering thermal aging effects;Chen;IEEE Trans. Device Mater. Rel.,2014

4. Turn-off time as an early indicator of insulated gate bipolar transistor latch-up;Brown;IEEE Trans. Power Electron.,2012

5. SKiM IGBT Modules Technical Explanations;Zanin,2013

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3. Enablers for Overcurrent Capability of Silicon-Carbide-Based Power Converters: An Overview;IEEE Transactions on Power Electronics;2023-03

4. Investigation on fatigue mechanism of solder layers in IGBT modules under high temperature gradients;Microelectronics Reliability;2023-02

5. A 3-D Thermal Network Model for Monitoring of IGBT Modules;IEEE Transactions on Electron Devices;2023-02

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