A 3-D Thermal Network Model for Monitoring of IGBT Modules
Author:
Affiliation:
1. College of Electrical and Information Engineering, Hunan University, Changsha, China
Funder
National Natural Science Foundation of China
Huxiang High-level Talent Gathering Project
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx7/16/10025571/09982551.pdf?arnumber=9982551
Reference38 articles.
1. A Multi-timescale Prediction Model of IGBT Junction Temperature
2. Thermal modeling of wire-bonded power modules considering non-uniform temperature and electric current interactions
3. Lumped Dynamic Electrothermal Model of IGBT Module of Inverters
4. A Thermal Modeling Method Considering Ambient Temperature Dynamics
5. Modeling and Characterization of Frequency-Domain Thermal Impedance for IGBT Module Through Heat Flow Information
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